During sputtering, the material is vaporized and deposited as a coating directly from solid into gas. In traditional processes, the coating material must be melted. This inevitably creates droplets that become blemishes on the coating structure and lead to a very rough surface. During sputtering, these droplets do not appear. The USP of the sputter technology is the extremely smooth surface. Another advantage of the sputter technology is a significant reduction of the internal stress inside the coating.
HiPIMS is the next generation technology of DC sputtering. The performance peaks with the HiPIMS process form a high energy plasma that ionizes the deposited materials at unprecedented levels. The high flux of highly ionized species result in a very dense and a nearly completely amorphous coating structure.